Packages


 

  • JEDEC Standard package
  • Mature product
  • Available in 3lds and 5lds option
  • Solder dipped on Solder plated lead finish
  • Pb free option available

 

DETAILS

  Package Type TO-247 (Standard and Extended)
  Lead Count 3LDS / 5LDS
  Package Dimension (L x W x H) 1.619 x 0.626 x 0.198
  Number of Die Capable Single / Dual

 

  • JEDEC Standard package
  • Mature product
  • Available in 3 leads and 5 leads option
  • Solder dipped on Solder plated lead finish
  • Pb free option available


 

  • Also known as the ISOTOP package, JEDEC standard
  • Isolated or non-isolated base plate options
  • Matured product
  • Guaranteed isolation at 3KV minimum
  • Available in 4 leads with 4 major leadframe design options
  • Buck and Boost configuration also available

 

DETAILS

Package Type

SOT-227

Lead Count

4LDS

Package Dimension (L x W x H)

1.50 x 0.980 x 0.476

Number of Die Capable

Single / Dual / Multichip


 

  • An extended version of the standard SOT-227
  • More flexible than the standard SOT-227
  • Under package development, already started building prototypes
  • Much improved space for a more hybrid and integrated function
  • Available in 4L and 6L versions (power terminals)
  • Isolated and non-isolated versions
  • Optional signal (7 max each side) leads for circuit interface

 

DETAILS 

Package Type

SOT-227 EXT

Lead Count

4LDS / 6LDS

Number of Die Capable

Single / Dual / Multichip

 

 

  • Available in 10 leads option
  • Solder dipped on Solder plated lead finish
  • Pb free option available